Surface-mount packages range in size from small to minuscule. They are all designed to sit on one side of a circuit board and be soldered to the surface. The pins of a SMD package either extrude out the side, perpendicular to the chip, or are sometimes arranged in a matrix on the bottom of the chip. ICs in this form factor are not very “hand-assembly-friendly.” They usually require special tools to aid in the process.
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